◢ We design the silicon
From IC design to fabricated and diced wafer.
Engeletron does not merely use chips — we design the integrated circuit. The EETX433A originates as a die on a silicon wafer, manufactured and diced into thousands of units, packaged in SOIC‑8.
◢ Conception & Design
🇧🇷 Brazil — Engeletron
The concept, RF architecture, and design/IP of the EETX433A are ours, created in Brazil.
◢ Fabrication & Wafer
🌏 Partners — China
Wafer production and packaging are carried out by partner foundries in China, which bring together the equipment, expertise, and cost structure needed to manufacture at quality scale.
Fabless model, with full transparency: the design and IP of the EETX433A belong to Engeletron; manufacturing is handled by partners with the infrastructure to do it — the same way the world's largest chip companies operate.
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Die design — RF architecture, internal oscillator and encoding, in silicon.
▢
Wafer fabrication — hundreds of dies per wafer.
✂
Dicing — the wafer is sawn into individual chips.
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Packaging — each die becomes an EETX433A in SOIC‑8, ready for production.
Silicon wafer · fabrication and dicing
01
Design
RF IC design
→02
Wafer
Wafer fabrication
→03
Dicing
Chip singulation
→04
EETX433A
SOIC‑8 ready